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On June 25, Xiamen C&D Emerging Industry Equity Investment Co., Ltd. (hereinafter referred to as "C&D Emerging Industry Equity Investment") successfully issued the first tranche of its 2025 technology innovation bonds! This bond has an issue size of RMB 800 million, a 5-year maturity, a coupon rate of 2.37%, and achieved an overall subscription multiple of 2.06 times.

This issue of technology innovation bonds marks the first tech innovation bond released in the interbank market by a private equity fund manager in Fujian Province since the launch of the "Tech Board" in the bond market. Furthermore, it represents the first tech innovation bond issued in the interbank market in Xiamen. The successful issuance of this bond was facilitated by the robust support of the National Association of Financial Market Institutional Investors, Xiamen Branch of the People's Bank of China, lead underwriters, and investors. The issuance achieved a record-low rate for the company's bonds of the same term.

C&D Emerging Investment, as a proactive contributor to technology innovation bonds, has successfully issued a total of 12 bonds related to technology innovation in both the exchange and interbank markets, raising nearly RMB 6 billion to date. All funds raised have been 100% dedicated to supporting the development of the technology innovation sector, continuously providing low-cost, long-term capital to fuel growth in this field. In the future, C&D Emerging Investment will continue to promote the national innovation-driven development strategy, serve as a key funding hub, and persistently contribute to the advancement of the technology innovation sector!